FREUDENSTADT, Germany, Nov. 10, 2025 — SCHMID Group (NASDAQ: SHMD), a global provider of equipment and solutions for manufacturing Printed Circuit Boards (PCBs) and IC-Substrates, announced that it has received two major orders for Panel Level Packaging and mSAP production equipment, reflecting success in a rapidly expanding market.
One project will see SCHMID delivering a cluster configuration of its InfinityLine C+ and InfinityLine H+ equipment to a customer in Southeast Asia. This customer is a leading global technology firm operating in the semiconductor and infrastructure software sectors. They provide connectivity, storage, and computing solutions for data centers, mobile networks, and enterprise systems globally. Their offerings include high-performance chips, custom silicon, and security software platforms that support cloud, AI, and 5G innovation. The company has established a resilient and diversified business through acquisitions and R&D investments, combining hardware expertise with recurring software revenue and becoming a key player in next-generation digital infrastructure.
The second project involves supplying horizontal InfinityLine H+ and vertical InfinityLine V+ machines to a customer in China. This equipment will support the expansion of their mSAP capacities, primarily for manufacturing AI Server PCBs and similar products. This customer is a leading manufacturer in the electronics interconnect sector, specializing in high-end PCBs, IC substrates, and electronic assembly solutions for advanced computing, communication, and automotive systems worldwide. They offer comprehensive design-to-manufacturing services and large-scale production for AI servers, 5G infrastructure, and consumer electronics. Through ongoing investments in R&D, automation, and sustainable production, they have built a reputation for technological excellence and reliability, becoming a key enabler for next-generation semiconductor packaging and system integration.
Market Context: AI and Semiconductor Growth
These orders highlight SCHMID Group’s increasing importance in facilitating advanced electronics manufacturing amidst growing AI-driven demand.
According to IDC, global semiconductor revenues are expected to reach $785 billion in 2025 and climb to $1.1 trillion by 2029, largely due to the increasing use of AI-centric architectures and data-intensive computing. TrendForce predicts a 24% year-over-year increase in AI server shipments in 2025, driven by demand from North American hyperscalers and supported by growing sovereign cloud initiatives in Europe and the Middle East.
This increase in AI infrastructure investment is transforming the IC-substrate and advanced PCB ecosystem. TechSearch International reports a significant rise in demand for large-body substrates as designs incorporate more high-bandwidth memory (HBM) stacks and use co-packaged optics (CPO) to meet the performance and bandwidth demands of next-generation technologies. These factors emphasize the strategic importance of SCHMID’s advanced process equipment portfolio, which allows for scalable, high-yield manufacturing of next-generation packaging technologies.
Executive Statement
“These projects demonstrate our customers’ trust in SCHMID’s ability to provide dependable and scalable production solutions for advanced packaging,” said Roland Rettenmeier, CSO of SCHMID Group. “The rising demand for AI-driven semiconductors is changing the requirements for IC-substrates and advanced PCBs. Our InfinityLine product family and innovative technologies enable our partners to achieve the necessary performance, yield, and sustainability goals for this new era of high-density packaging.”
Forward-Looking Statements
This press release includes “forward-looking statements.” These statements are not based on historical facts and are subject to various conditions, many of which are outside the Company’s control. These conditions are detailed in the “Risk Factors” section of the Company’s registration statement and final prospectus filed with the SEC. Copies are available on the SEC’s website. The Company is not obligated to update these statements after this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are based in Freudenstadt, Germany. Founded in 1864, the company employs over 800 people worldwide and has technology centers and production facilities in Germany and China, along with global sales and service locations. The Group focuses on developing customized equipment and process solutions for industries including electronics, renewable energy, and energy storage. Our system and process solutions for producing substrates, printed circuit boards, and other electronic components ensure advanced technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit:
Sources for market data:
TechSearch International, Advanced Packaging Update, Volume 2 – July 2025; IDC; TrendForce.
Contact
A photo accompanying this announcement is available at

“`